| PART |
Description |
Maker |
| 21-0109B |
PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD
|
Maxim Integrated Products, Inc.
MAXIM - Dallas Semiconductor
|
| 90-0092 |
PACKAGE LAND PATTERN, (U8) UMAX 8 LEAD
|
Maxim Integrated Products
|
| MAX552AEPA MAX552AEUB MAX551/MAX552 |
12-Bit Digital-to-Analog Converter
3V/ 5V 12-Bit Serial Multiplying DACs in 10-Pin uMAX Package
|
Maxim Integrated Products, Inc.
|
| 8SOIC |
8 PIN SOIC PACKAGE OUTLINE
8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| SOP-8 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT263 |
Package outline
|
NXP
Philips Semiconductors
|
| TQFN5X5-40 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN5X5-32 |
Package Outline
|
Global Mixed-mode Techn...
|
